IEC 60191-6-6:2001 PDF
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
Открыть превью (PDF)Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)Название (английский):
IEC 60191-6-6:2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 12
- Дата публикации:
- 22 марта 2001 г.
- Издание:
- IEC IS 60191 edition 1 version 1
- ICS:
- 31.080.01
Описание (английский):
IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
Технические детали
- Технический комитет
- SC 47D - Semiconductor devices packaging
- SKU
- IEC 60191-6-6:2001
